The William States Lee College of Engineering

Manuscript Accepted by Additive Manufacturing Journal

Our new manuscript, Optical interconnects on a flexible substrate by multi-material hybrid additive and subtractive manufacturing, has been accepted by Additive Manufacturing Journal. I would like to thank the co-authors (Dianhao Hou, Zhimin Shi, Thomas Weller, and Venkat Bhethanabotla) for all our hard work in getting this important research published in such a high impact journal.